Title:
エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP4765150
Kind Code:
B2
More Like This:
Inventors:
Takashi Aihara
Application Number:
JP2000216833A
Publication Date:
September 07, 2011
Filing Date:
July 18, 2000
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; C08G59/62; C08G79/02; C08G79/025; C08K3/00; C08K3/22; C08K5/5399; C08L85/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP2000103939A | ||||
| JP10259292A | ||||
| JP2001316454A | ||||
| JP2001261792A | ||||
| JP2001192392A | ||||
| JP11181429A |