Title:
エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP5487540
Kind Code:
B2
Abstract:
An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.
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| JPS601224 | EPOXY RESIN MOLDING MATERIAL |
Inventors:
Yasuhiro Mizuno
Application Number:
JP2007508220A
Publication Date:
May 07, 2014
Filing Date:
March 13, 2006
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/62; C08K3/00; C08K5/00; C08L13/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JPH11140274A | 1999-05-25 | |||
| JPH09153570A | 1997-06-10 | |||
| JPH1117075A | 1999-01-22 | |||
| JPH11140274A | 1999-05-25 | |||
| JPH09153570A | 1997-06-10 | |||
| JPH1117075A | 1999-01-22 | |||
| JPH10287794A | 1998-10-27 | |||
| JPS649214A | 1989-01-12 | |||
| JPS63275625A | 1988-11-14 | |||
| JP2003128874A | 2003-05-08 | |||
| JPS63230725A | 1988-09-27 | |||
| JPH0256941A | 1990-02-26 | |||
| JPS6320319A | 1988-01-28 | |||
| JP2001089638A | 2001-04-03 | |||
| JPS61287952A | 1986-12-18 |
Attorney, Agent or Firm:
Shinji Hayami