Title:
半導体封止用エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP4894387
Kind Code:
B2
Inventors:
Yoshinori Nishitani
Application Number:
JP2006199314A
Publication Date:
March 14, 2012
Filing Date:
July 21, 2006
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/62; C08G59/24; C08K3/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005298794A | ||||
| JP2006124643A |
Foreign References:
| WO2006009147A1 |