Title:
半導体封止用エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP5162833
Kind Code:
B2
Inventors:
Yoshinori Nishitani
Application Number:
JP2006049356A
Publication Date:
March 13, 2013
Filing Date:
February 24, 2006
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; C08K5/13; C08L13/00; C08L61/06; H01L23/29; H01L23/31
Domestic Patent References:
| JP11140274A | ||||
| JP63035615A | ||||
| JP63230725A | ||||
| JP9153570A | ||||
| JP11017075A | ||||
| JP2086149A | ||||
| JP62072745A | ||||
| JP10130374A |
Foreign References:
| WO2006098425A1 |