Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR AND PRODUCTION OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH03177450
Kind Code:
A
Abstract:
PURPOSE:To obtain an epoxy resin composition for semiconductor capable of giving semiconductor device having high reliability without decrease of fluidity due to the addition of a large amount of filler by adding a spherical molten silica having a specific spheroidicity and particle size distribution as a filler. CONSTITUTION:(A) Epoxy resin is mixed with (B) spherical molten silica powder having 0.7-1 spheroidicity measured by Waadel spheroidicity and having a particle size distribution of 16-23wt.% particles having <=2mum diameter, 55-80wt.% particles (a total of <=2mum and <=12mum particles and so forth having <=12mum diameter, >=94.5wt.% particles having <=45mum diameter and <=0.01wt.% large particles having >=100mum diameter, preferably having 5-9mum average particle diameter and 1-5m<2>/g specific surface area. Then, curing agent or plasticizer, etc., is added to the resultant mixture, as necessary, to afford the objective epoxy resin composition for sealing of semiconductor giving 1.8-4X10<-5>/ deg.C linear thermal expansion coefficient of the cured material.
More Like This:
Inventors:
YAMANE MANABU
OMORI EIJI
SHIGA SATOSHI
OMORI EIJI
SHIGA SATOSHI
Application Number:
JP31615089A
Publication Date:
August 01, 1991
Filing Date:
December 05, 1989
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08K3/00; C08G59/00; C08L63/00; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): C08K3/00; C08L63/00; H01L21/56; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Kunihiko Wakabayashi