To provide an epoxy resin composition for semiconductor sealing which can give a semiconductor device excellent in moisture resistance, storage stability, and reliability.

This resin composition contains (a) an epoxy resin, (b) a phenol resin, (c) an inorganic filler having an average particle size of 1-15 μm, a maximum particle size of 32 μm or lower, a Rosin-Rammler N value of 1.0-1.2, and a circularity of 0.70 or higher, and (d) a mixture prepared by melt mixing dicyandiamide having an average particle size of 0.1-10 μm with a phenol resin in a wt. ratio of (1:1)-(1:10). The resin composition is used for sealing a semiconductor element in the process for producing a semiconductor device by bringing a circuit electrode of a printed circuit substrate into contact with an electrode of a semiconductor element via solder, thermally melting the solder to bond the substrate to the element, setting the substrate having the element mounted thereon into a metal mold cavity, and sealing the element and the gap between the substrate and the element.