Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE
Document Type and Number:
Japanese Patent JPH03177415
Kind Code:
A
Abstract:
PURPOSE:To provide the title composition capable of developing low stress in sealing semiconductors therewith, excellent in mold non-contaminability, favorable in marking nature, to be used for sealing semiconductor elements by transfer molding, etc., comprising an epoxy resin, curing agent, filler and specific polymer. CONSTITUTION:The objective composition comprising (A) an epoxy resin, (B) a curing agent (e.g. novolak-type phenolic resin), (C) a filler (pref. silica), and (D) a polymer formed by reaction between (a) an epoxy resin and (b) a carboxyl group-contg. organopolysiloxane consisting of (1) dimethylpolysiloxane, <=20 in polymerization degree and (2) an organopolysiloxane of the formula (X is carboxyl; R is alkyl except methyl, phenyl or aralkyl; (a), (b) and (c) are each >=1).
Inventors:
KINASHI KEIICHI
SAITO HIROYUKI
HAGIWARA SHINSUKE
AKAGI SEIICHI
FURUSAWA FUMIO
ICHIMURA SHIGEKI
SAITO HIROYUKI
HAGIWARA SHINSUKE
AKAGI SEIICHI
FURUSAWA FUMIO
ICHIMURA SHIGEKI
Application Number:
JP31618889A
Publication Date:
August 01, 1991
Filing Date:
December 05, 1989
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L23/29; C08G59/14; C08G59/18; C08L63/00; H01L23/31; (IPC1-7): C08G59/14; C08G59/18; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Hirose Akira