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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION FOR SYNTHETIC WOOD
Document Type and Number:
Japanese Patent JPS54153861
Kind Code:
A
Abstract:

PURPOSE: To obtain a cured article having well-balanced lightweight and cutting properties, surface and mechanical strengths, by hot-curing a blend of an epoxy resin, specific amounts of glass microballoons, and silas balloons, and a curing agent.

CONSTITUTION: An epoxy resin having one or more epoxy groups in the molecule is incorporated with (A) glass microballoons having a specific gravity of 0.2W0.4 and a particle size ≤200μ comprising borosilicate or silica glass and (B) 10W50% by wt. based on (A) of silas balloons having a specific gravity of 0.1W0.4 and a particle size ≤600μ to give the total content of (A) and (B) of 30W60% based on the whole composition. The composition is then kneaded with a polyamine or acid anhydride type curing agent, e.g. triethylene tetramine, filled in a mold of given shape, and hot-cured. The resulting article is suitable for synthetic wood, particularly a master model, and reusable because of high scratch resistance.


Inventors:
TOMINAGA KAORU
MATSUZAWA AKIO
Application Number:
JP6091178A
Publication Date:
December 04, 1979
Filing Date:
May 24, 1978
Export Citation:
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Assignee:
MITSUI PETROCHEMICAL IND
International Classes:
C08G59/00; C08G59/50; C08K7/24; C08L63/00; C08L77/00; (IPC1-7): C08G59/50; C08K7/24; C08L63/00