Title:
EPOXY RESIN COMPOSITION FOR THICK COPPER CIRCUIT FILLING
Document Type and Number:
Japanese Patent JP2019056076
Kind Code:
A
Abstract:
To provide an epoxy resin composition that can effectively radiate the heat emitted from a thick copper circuit when made into a cured product.SOLUTION: An epoxy resin composition for thick copper circuit filling contains an epoxy resin having a mesogenic skeleton represented by formula (I-0), and a curing agent. In the resin composition, a phase transition temperature at which phase transition occurs from a crystal phase in the epoxy resin having the mesogenic skeleton to a liquid crystal phase is 140°C or less. In the resin composition, the epoxy resin having the mesogenic skeleton contains a reactant between a phenolic compound and an epoxy compound having a mesogenic skeleton (R-Rindependently represent H or a C1-3 alkyl group).SELECTED DRAWING: None
Inventors:
KATAKI HIDEYUKI
YAMAURA ITARU
KANG DONG-CHEOL
TAKAHASHI HIROYUKI
TOGAWA MITSUO
AMANUMA SHINJI
YAMAURA ITARU
KANG DONG-CHEOL
TAKAHASHI HIROYUKI
TOGAWA MITSUO
AMANUMA SHINJI
Application Number:
JP2017182263A
Publication Date:
April 11, 2019
Filing Date:
September 22, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/00; H01L23/14; H01L23/36; H05K1/03
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office