To provide an epoxy resin composition which includes excellent adhesive property and flexibility at low temperatures (about -20C) to normal temperature as well as elevated temperatures (about 80C) and is suitable for use as a structural adhesive.

The epoxy resin composition includes 100 pts.mass of epoxy resin (A), 5-100 pts.mass of core-shell particles (B), and a curing agent (C), in which the core-shell particles (B) include acrylonitrile in the monomer used during the production of the shell layer.