Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3656224
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtian a heat-resistant epoxy resin composition which can realize a low cost and very thin multilayer printed wiring board having by mixing an epoxy resin/acid anhydride adduct with an aromatic epoxy resin and a cure accelerator in a specified mixing ratio.
SOLUTION: This composition is one having the ability to form a thermosetting insulation layer and comprising the three components: 20-75wt.% epoxy resin/acid anhydride adduct (A) represented by formula I (wherein R1 and R2 are each H, a 1-5C alkyl or a halogen; X is -SO2-, -CH2- or the like; 1 is 0 or 1; R3s are each H or a group represented by formula II (wherein Y is an acid anhydride residue; m is 1-3; and Z is a group represented by formula III or -R3), provided that the rate of Rs which are hydrogen atoms is at most 85% based on the total R3s) and having a molecular weight of 10,000-200,000, a halogen content of 5-40wt.%, an epoxy/acid anhydride adduct having an acid value of 30-250mgKOH/g, an aromatic epoxy resin (B) and a cure accelerator (C).
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Inventors:
Chiaki Asano
Hiroshi Sato
Masao Gunji
Hiroshi Sato
Masao Gunji
Application Number:
JP30858996A
Publication Date:
June 08, 2005
Filing Date:
October 14, 1996
Export Citation:
Assignee:
Toto Kasei Co., Ltd.
International Classes:
C08L63/00; C08G59/42; C08G65/28; H05K1/03; H05K3/46; (IPC1-7): C08L63/00; C08G59/42; H05K1/03; H05K3/46
Domestic Patent References:
| JP10090887A | ||||
| JP9015861A | ||||
| JP8325339A | ||||
| JP2212544A | ||||
| JP59166524A | ||||
| JP3059021A | ||||
| JP3014817A |
Attorney, Agent or Firm:
Toshio Takikawa
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