Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3841528
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject composition, excellent in hardenability and generating little ionic impurities, e.g. chlorine ions in the hardened material, by including an epoxy resin, phenolic resin, specific hardening promoter and inorganic filler.
SOLUTION: This composition comprises (A) an epoxy resin (e.g. a novolak type epoxy resin having an epoxy equivalent of 170 to 300), (B) a phenolic resin (e.g. a phenolic novolak resin), (C) a hardening promoter composed of 1,2-alkylenebenzimidazole compound shown by the formula (R1 and R2 are each H, a halogen or the like; and (n) is 2 to 5), e.g. 1,2-ethylenebenzimidazole), and (D) an inorganic filler, e.g. powdered silica glass. It is preferable that the above composition contains 0.002 to 2.0 wt.% of the component C.
Inventors:
Goji Toyoda
Miya Tanioka
Takayuki Murai
Takashi Yoshioka
Miya Tanioka
Takayuki Murai
Takashi Yoshioka
Application Number:
JP28787497A
Publication Date:
November 01, 2006
Filing Date:
October 03, 1997
Export Citation:
Assignee:
Shikoku Chemical Industry Co., Ltd.
International Classes:
C08G59/40; C08K3/00; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/40; C08G59/62; C08K3/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP1171447A |