Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3891842
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which can give a cured product having low water absorptivity and low-stress properties and is used as a structural adhesive, a cation electrodeposition resin, civil engineering material and a semiconductor sealing material excellent in soldering-heat resistance and heat-cycle resistance.
SOLUTION: The epoxy resin composition contains a polyglycidyl ether compound represented by formula (1) (wherein R1 is an alkyl, an aryl, an alkylaryl, or an arylalkyl; R2 is hydrogen or methyl; A is a direct bond, an alkylene, a cycloalkylene, a halogen-, alkyl-, perfluoroalkyl-, cycloalkyl-, or aryl-substituted alkylene, -O-, -S-, -SS-, -SO-, -SO2-, -CO-, or -OCO-; m and n are each 1 or 2; and p and q are each 1-10) as the polyepoxy compound.
Inventors:
Hiroshi Waki
Koji Akimoto
Koji Akimoto
Application Number:
JP2002000607A
Publication Date:
March 14, 2007
Filing Date:
January 07, 2002
Export Citation:
Assignee:
ADEKA CORPORATION
International Classes:
C08G59/24; H01L23/29; H01L23/31; (IPC1-7): C08G59/24; H01L23/29; H01L23/31
Domestic Patent References:
| JP2503009A | ||||
| JP2502927A | ||||
| JP6179801A |
Attorney, Agent or Firm:
Osamu Hatori