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Title:
エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP4633887
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a formulation for improving the toughness of an epoxy resin. SOLUTION: There is provided an epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and an ethylene.(meth)acrylate ester copolymer rubber (C), wherein 100 pts.wt. of the epoxy resin (A) is blended with 1-50 pts.wt. of the ethylene.(meth)acrylate ester copolymer rubber (C).

Inventors:
Tatsuya Watanabe
Murakami Atsushi
Application Number:
JP2000168588A
Publication Date:
February 16, 2011
Filing Date:
June 06, 2000
Export Citation:
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Assignee:
Mitsui DuPont Polychemical Co., Ltd.
International Classes:
C08L63/00; C08L33/06
Domestic Patent References:
JP10310678A
JP62250023A
JP63056520A
JP8217958A
JP9255848A
JP10251380A
Attorney, Agent or Firm:
Izawa Kou
Izawa Miki
Shoko Mitani
Akiko Yamashita



 
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