Title:
エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP6682553
Kind Code:
B2
Abstract:
The present invention relates to adhesive compositions containing a prepolymer which can be obtained by reacting a reaction mixture containing: at least one epoxy resin; at least one polyetherdiamine or polyethertriamine; at least one carboxyl-terminated butadiene-acrylonitrile copolymer (CTBN); and rubber particles having a core/shell structure. The invention also relates to methods for curing said compositions, to the cured adhesive compositions thus obtained, to the use thereof for bonding components and to the components thus obtained.
Inventors:
Christian Holtgreve
Halalto custard
Thomas Bahon
Reiner Schoenfeld
Halalto custard
Thomas Bahon
Reiner Schoenfeld
Application Number:
JP2017551000A
Publication Date:
April 15, 2020
Filing Date:
December 17, 2015
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
C09J163/00; C09J5/00; C09J11/06; C09J11/08; C09J109/02; C09J151/04
Domestic Patent References:
JP6508650A | ||||
JP2009506169A |
Foreign References:
WO2013151835A1 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Hiroshi Yamazaki
Kenichi Morizumi
Hiroshi Yamazaki
Kenichi Morizumi