Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH03195721
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition having excellent thermal stress resistance applied to IC package in soldering, cracking resistance and water-vapor resistance comprising a specific epoxy resin, a specific curing agent of phenol resin, an inorganic filler and a curing promoter as essential components. CONSTITUTION:The objective composition comprising (A) an epoxy resin containing 30-100wt.%, preferably >=60wt.% based on total amounts of epoxy resins of a biphenyl type epoxy resin shown by formula I (R1 to R6 are H, halogen or alkyl); (B) a curing agent of phenol resin, containing 50-100%, preferably >=70% based on total amounts of curing agents of phenol resin of a trihydric curing agent of phenol resin shown by formula II (R1 to R11 are H, halogen or alkyl), (C) an inorganic filler (preferably fused silica powder) and (D) a curing promoter (e.g. diazabicycloundecene) as essential components.
Inventors:
MOGI NAOKI
NARUSE SHIGERU
NARUSE SHIGERU
Application Number:
JP33294389A
Publication Date:
August 27, 1991
Filing Date:
December 25, 1989
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08G59/00; C08G59/20; C08G59/22; C08G59/62; H01L23/29; H01L23/31; (IPC1-7): C08G59/22; C08G59/62; C08L63/00; H01L23/29; H01L23/31