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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH10279781
Kind Code:
A
Abstract:

To obtain the subject composition developing excellent heat-resistance and electrical properties by including a preparatory reaction product of an epoxy compound with a phenol-modified polyphenylene ether and a cyanate compound as essential components.

This composition contains (A) a preparatory reaction product obtained by the preparatory reaction of (i) an epoxy compound having ≥2 epoxy groups in one molecule with (ii) a phenol-modified polyphenylene ether (abbreviated as PPE) obtained by the rearrangement reaction of PPE in the presence of phenols and a radical initiator and (B) a cyanate compound (preferably an aromatic compound having ≥2 cyanate groups in one molecule) as essential components. The number-average molecular weight of the component (ii) is preferably 500-7,000 and the average molecular weight of the component A is preferably 500-5,000 including the unreacted materials in the components (i) and (ii). The composition is useful for printed circuit board, etc.


Inventors:
OKUMOTO SATOSHI
KURODA CHIHIRO
Application Number:
JP8285097A
Publication Date:
October 20, 1998
Filing Date:
April 01, 1997
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08K5/29; C08L63/00; C08L71/00; C08L71/12; H05K1/03; (IPC1-7): C08L63/00; C08K5/29; C08L71/12
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)