Title:
エポキシ樹脂組成物、並びに該樹脂組成物を用いて製造された接着フィルム、プリプレグ、多層プリント配線板、及び半導体装置
Document Type and Number:
Japanese Patent JP6984579
Kind Code:
B2
Abstract:
To provide an epoxy resin composition which is useful for high-frequency applications, is excellent in handleability when formed into a film, and gives a cured product excellent in heat resistance and dielectric characteristics.SOLUTION: The epoxy resin composition contains the following components (A)-(D): (A) an epoxy resin; (B) an active ester curing agent; (C) a cyclic imide compound containing at least one dimer acid skeleton, at least one linear alkylene group having six or more carbon atoms, and at least two cyclic imide groups in the molecule; and (D) a curing accelerator.SELECTED DRAWING: None
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Inventors:
Yoshihiro Tsutsumi
Yuki Kudo
Hamamoto Yoshihide
Yuki Kudo
Hamamoto Yoshihide
Application Number:
JP2018223713A
Publication Date:
December 22, 2021
Filing Date:
November 29, 2018
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G59/40; C08K3/013; C08L63/00
Domestic Patent References:
| JP201090238A | ||||
| JP2011132507A | ||||
| JP2016131243A | ||||
| JP201641797A |
Foreign References:
| WO2016114287A1 | ||||
| WO2019189466A1 | ||||
| WO2020045408A1 |
Attorney, Agent or Firm:
Ushiki International Patent Office
Mamoru Ushiki
Mamoru Ushiki
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