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Patent Searching and Data


Title:
EPOXY RESIN AND CURABLE COMPOSITION CONTAINING THE SAME
Document Type and Number:
Japanese Patent JPH09249733
Kind Code:
A
Abstract:

To obtain a curable compsn. improved in the resistances to water and corrosion, adhesive properties, and solubility in mineral spirit by compounding a specific alkylbisphenol epoxy resin with a curative.

1mol of phenolic hydroxyl group of an alkylbisphenol is reacted with 1.5-15mol of an epihalohydrin in the presence of 0.8-1.3mol of an alkali metal hydroxide under a pressure of 50-760mmHg at 40-120°C for 0.5-15hr to give an alkylbisphenol epoxy resin represented by the formula [wherein n≥1; m ≥0; R1 is 1-9C alkyl; 1≤(a+a')≤4; R2 is 1-9C alkyl; 1≤(b+b')≤4; and X is CH2, C(CH3)2, or SO2] and having an epoxy equivalent of 180-2,000g/eq. An epoxy resin component contg. 50wt.% or higher above-obtd. resin is compounded with an amine curative to give a curable compsn.


Inventors:
YOSHIDA KAZUHIKO
TAKEDA YASUYUKI
Application Number:
JP5948796A
Publication Date:
September 22, 1997
Filing Date:
March 15, 1996
Export Citation:
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Assignee:
TOTO KASEI CO LTD
International Classes:
C08G59/06; C08G59/20; C08G59/24; C08G59/50; (IPC1-7): C08G59/06; C08G59/24; C08G59/50
Attorney, Agent or Firm:
Hiroshi Tanaka (1 outside)