Title:
エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
Document Type and Number:
Japanese Patent JP6550843
Kind Code:
B2
Inventors:
Uemura Uemura
▲高▼橋 淳
Takaaki Watanabe
▲高▼橋 淳
Takaaki Watanabe
Application Number:
JP2015067197A
Publication Date:
July 31, 2019
Filing Date:
March 27, 2015
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
C08G59/22; C08G59/62; C09J7/20; C09J11/06; C09J163/00; C09J163/02; H05K1/03
Domestic Patent References:
| JP2001526130A | ||||
| JP2005532167A | ||||
| JP2008518771A | ||||
| JP2003252951A |
Foreign References:
| WO2013183736A1 |
Attorney, Agent or Firm:
Tsuyoshi Shigeno