Title:
封止用エポキシ樹脂成形材料及び電子部品装置
Document Type and Number:
Japanese Patent JP4941729
Kind Code:
B2
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Inventors:
Mitsuyoshi Hamada
Akira Nagai
Akira Nagai
Application Number:
JP2007058534A
Publication Date:
May 30, 2012
Filing Date:
March 08, 2007
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L63/00; C08F230/08; C08L43/04; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005213337A | ||||
| JP2006124569A | ||||
| JP2006241440A | ||||
| JP4836922B1 | ||||
| JP229419A |