Title:
EPOXY RESIN MOLDING MATERIAL FOR SEALING
Document Type and Number:
Japanese Patent JPH05214216
Kind Code:
A
Abstract:
PURPOSE:To prepare the title material exhibiting an excellent crack resistance during soldering under humid conditions by compounding a reaction product of an aminosilane coupling agent with an epoxidized organopolysiloxane with an epoxy resin and other necessary ingredients. CONSTITUTION:2 pts.wt. aminosilane coupling agent is reacted with an epoxidized organopolysiloxane, pref. in an amt. of 10 pts.wt., at 50-160 deg.C. The reaction product is compounded with an epoxy resin (e.g. a bisphenol A epoxy resin), a curative (e.g. a novolac phenol resin), an accelerator (e.g. triphenylphosphine), an inorg. filler (e.g. silica), a wax, a rubberlike component. etc., to give the title material.
Inventors:
TOYAMA TAKASHI
KIYOUGAKU MASAYUKI
TORII MUNETOMO
KIYOUGAKU MASAYUKI
TORII MUNETOMO
Application Number:
JP1809892A
Publication Date:
August 24, 1993
Filing Date:
February 04, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L63/00; C08G59/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Mikio Kawase (1 person outside)