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Title:
EPOXY RESIN MOLDING MATERIAL FOR SEALING
Document Type and Number:
Japanese Patent JPH06200124
Kind Code:
A
Abstract:

PURPOSE: To obtain an epoxy resin molding material for sealing having high thermal conductivity and high moisture resistance and excellent in moldability.

CONSTITUTION: The epoxy resin for sealing contains a alumina having ≥99.5wt.% purity, ≤0.3wt.% Na2O content, ≤10ppm sodium ion content of extracted water, ≤3ppm chlorine ion and 5-60μm average particle diameter and silica.


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Inventors:
MIYATANI YOSHIHIRO
ICHIKAWA TAKAYUKI
KYOTANI YASUHIRO
Application Number:
JP133993A
Publication Date:
July 19, 1994
Filing Date:
January 07, 1993
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08G59/14; C08G59/62; C08K3/22; C08K3/36; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/14; C08G59/62; C08K3/22; C08K3/36; H01L23/29; H01L23/31
Domestic Patent References:
JPH04253759A1992-09-09
JPH0243279A1990-02-13
JPH01190748A1989-07-31
JPH02168654A1990-06-28
JPH03718A1991-01-07
JPH03719A1991-01-07
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)



 
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