Title:
EPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2001278948
Kind Code:
A
Abstract:
To provide an epoxy resin molding material capable of the injection molding that is excellent in the heat stability in a cylinder and also has little hazing of mold.
The epoxy resin molding material capable of the injection molding is characterized by containing an orthocresol novolak epoxy resin of 70°C or more of a softening point as an epoxy resin and a novolak phenol resin as a hardening accelerator, and also a dimethylurea hardening accelerator shown by chemical formula (1) or (2) as an essential component.
Inventors:
KAWAMURA SATORU
Application Number:
JP2000093408A
Publication Date:
October 10, 2001
Filing Date:
March 30, 2000
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B29C45/00; C08G59/20; C08G59/56; C08G59/62; C08K3/22; C08K3/36; C08K7/14; C08L63/04; (IPC1-7): C08G59/20; B29C45/00; C08G59/56; C08G59/62; C08K3/22; C08K3/36; C08K7/14; C08L63/04