Title:
エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
Document Type and Number:
Japanese Patent JP4803339
Kind Code:
B2
Abstract:
An epoxy/silicone mixed resin composition comprising (A') an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based curing catalyst is used to encapsulate a light-emitting semiconductor member. The light-emitting semiconductor device undergoes little discoloration in a heat test, and has a high emission efficiency, a long life and reduced energy consumption.
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Inventors:
Tsutomu Kashiwagi
Toshio Shiobara
Toshio Shiobara
Application Number:
JP2003390482A
Publication Date:
October 26, 2011
Filing Date:
November 20, 2003
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L63/00; C08L83/06; C08G59/18; C08G59/68; C08L83/04; C08L83/05; C08L83/07; H01L33/54; H01L33/56; H01L33/62; C08K3/22; H01L23/29
Domestic Patent References:
| JP8224833A | ||||
| JP2003268239A | ||||
| JP5287077A | ||||
| JP4114056A | ||||
| JP2003213134A | ||||
| JP2004124089A | ||||
| JP9048916A |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa