PURPOSE: To obtain a manufacturing equipment of semiconductor device capable of improving productivity, by eliminating the electric charge of nitrogen gas by means of an static charge eliminator arranged in the vicinity of a gas injection pipe, the nitrogen gas being spouted against a wafer having a photoresist on its main surface.

CONSTITUTION: An injection pipe 13 is provided with respective gas injection holes 29 on its upper sides. From the injection holes 29 nitrogen gas 11 is spouted toward the ceiling part of a cover 25. In this constitution wherein the nitrogen gas 11 is not directly spouted against a hot plate 16, the nitrogen gas 11 circulates uniformly, so that the deterioration of a photoresist on the main surface of a wafer 14 can be prevented. A pipe constituting a gas conveying system 10 between the gas injection pipe 13 and a static charge eliminator 12 is made up of metal, in order that the nitrogen gas 11 whose electric charge is removed by the static charge eliminator 12 might hardly be charged as the result of friction with the pipe. Further the pipe is arranged in the manner in which the route is made short. Consequently, the attachment of foreign matter to the wafer caused by the nitrogen gas can be prevented, and the yield in a wafer treatment process is improved.