Title:
EQUIPMENT AND METHOD FOR DICE BOND
Document Type and Number:
Japanese Patent JP3798003
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide dice bond equipment wherein adhesive is applied as bonding agent to the rectangular whole region, air bubbles are not left between the adhesive, amount of extrusion of the adhesive from a bonding region is few, and further, procedures, such as rotation of a nozzle portion, are made unnecessary.
SOLUTION: The dice bond equipment is provided with the nozzle 10 which supplies adhesive to the rectangular bonding region of a chip mounting surface. The nozzle 10 is provided with a central nozzle 30 which spouts the adhesive in the center of the bonding region, and a plurality of peripheral nozzles 32 which are arranged at periphery of the central nozzle 30 and whose spouting amount of the adhesive is smaller than that of the central nozzle 30.
Inventors:
Muraki Shinji
Suzuki Shinsuke
Suzuki Shinsuke
Application Number:
JP2004029857A
Publication Date:
July 19, 2006
Filing Date:
February 05, 2004
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
Miyazaki Oki Electric Co., Ltd.
Miyazaki Oki Electric Co., Ltd.
International Classes:
H01L21/52; B05B1/14; B05C5/00; B65B1/00; B65C1/00; H01L21/00; H01L21/44; H01L21/58; B05C5/02; (IPC1-7): H01L21/52
Domestic Patent References:
| JP4252040A | ||||
| JP3283435A | ||||
| JP2028337A | ||||
| JP9293739A | ||||
| JP62183582U |
Attorney, Agent or Firm:
Takashi Ogaki