Title:
一つ以上の研磨面を使用して半導体ウェーハを研磨するための装置及び方法
Document Type and Number:
Japanese Patent JP2006524142
Kind Code:
A
Abstract:
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured to move to and from the wafer carriers in a linear reciprocating manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a pivoting manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a linear reciprocating manner.
Inventors:
Jeon in Kwon
Application Number:
JP2006513200A
Publication Date:
October 26, 2006
Filing Date:
April 21, 2004
Export Citation:
Assignee:
Inopura Incorporated
International Classes:
B24B37/34; B24B51/00; H01L21/304
Domestic Patent References:
| JPH11274119A | 1999-10-08 |
Attorney, Agent or Firm:
Masu Kobori
Takato Tsutsumi
Takato Tsutsumi