Title:
スパッタリングあるいはアーク蒸着用の装置
Document Type and Number:
Japanese Patent JP4253385
Kind Code:
B2
Abstract:
A linear magnetron cathode is disclosed which may be used as a vapor or plasma source for coating deposition or ion processing. The cathode has the shape of an elongated rectangular bar with vaporization of material occurring from an evaporable surface wrapping around the periphery of the bar, along two opposite sides and around both ends. A magnetic field is established over the entire evaporable surface which has a component parallel to the surface and perpendicular to the long direction of the cathode, forming a closed-loop magnetic tunnel around the periphery which directs an arc plasma discharge. Side shields adjacent to sand projecting outward from the sides of the evaporable surface block a significant fraction of the macroparticles ejected from reaching the substrate region. The invention provides uniform cathode erosion and a vaporized material stream in two directions over an extended length, permitting uniform deposition or implantation over large areas.
Inventors:
Richard P. Welty
Application Number:
JP37537698A
Publication Date:
April 08, 2009
Filing Date:
November 25, 1998
Export Citation:
Assignee:
Vapor Technologies, Inc.
International Classes:
C23C14/24; C23C14/32; C23C14/34; C23C14/35; H01J23/04; H01J25/50; H01J37/34
Domestic Patent References:
| JP7011440A | ||||
| JP11189868A |
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Yutaka Yoshida
Yukio Iwamoto
Hajime Asamura
Yutaka Yoshida
Yukio Iwamoto
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