Title:
チップ電子部品検査用のローラ電極接触子を備えた装置
Document Type and Number:
Japanese Patent JP7107589
Kind Code:
B2
Abstract:
Provided is a system for efficiently removing non-conductive contaminants deposited on a surface of a roller electrode terminal provided in a chip electronic component inspection and sorting device without damaging a surface of a transport disk. A soft tape having an abrasive powder layer formed on one surface thereof is formed on the roller electrode terminal such that the abrasive powder layer surface can continuously come into contact with the roller electrode at a location different from a location where the roller electrode comes into contact with the electrode of the chip electronic component.
More Like This:
| JP2003149288 | CONDUCTOR INSPECTING APPARATUS HAVING CONTACT SHEET |
| JPS614968 | PROBE DEVICE AND PROBE CARD |
| JPH07218421 | THERMO-HYGROSTAT |
Inventors:
Norihito Mori
Application Number:
JP2020144785A
Publication Date:
July 27, 2022
Filing Date:
August 28, 2020
Export Citation:
Assignee:
Human Laboratory Co., Ltd.
International Classes:
G01R31/26; B65G47/80; H01G13/00
Domestic Patent References:
| JP2018056483A | ||||
| JP2014153364A | ||||
| JP2015213121A | ||||
| JP2006194831A | ||||
| JP9325172A |
Attorney, Agent or Firm:
Yasuo Yanagawa