Title:
ETCHING METHOD AS WELL AS COLOR SELECTION MECHANISM AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP3282347
Kind Code:
B2
Abstract:
PURPOSE: To easily produce a color selection mechanism of a wide range of specifications by etching a material to be etched via an etching resist layer disposed in proximity to large and small apertures, thereby forming through- parts having recessed parts.
CONSTITUTION: The etching resist layer 20 is formed on the front surface of the material 10 which is to be etched and consists of a ferrous metallic sheet, etc., and a protective layer 12 consisting of a polyester, etc., is formed on the rear surface thereof. This resist layer 20 is patterned to form the first apertures 22 on the regions where the through-parts are desired to be formed and the second apertures 24 smaller than these apertures near these apertures. The material 10 to be etched is then etched by using an etching liquid, such as aq. ferric chloride soln. As a result, the through-regions 32 are formed in the material 10 to be etched below the first apertures 22 and the recessed parts 34 are formed below the second apertures 24. In addition, the materials 10C in the intermediate part thereof are removed and the resist layers thereon are destroyed and removed. The resist layers 20 and the protective layers 12 are thereafter removed by peeling.
Inventors:
Koichi Tago
Shinzo Takei
Sumito Shiina
Shinzo Takei
Sumito Shiina
Application Number:
JP1393794A
Publication Date:
May 13, 2002
Filing Date:
January 12, 1994
Export Citation:
Assignee:
ソニー株式会社
International Classes:
C23F1/00; C23F1/02; H01J9/14; H01J29/07; (IPC1-7): C23F1/00; H01J9/14; H01J29/07
Domestic Patent References:
| JP5747872A | ||||
| JP39756A |
Attorney, Agent or Firm:
Takahisa Yamamoto