Title:
エッチング液とその使用
Document Type and Number:
Japanese Patent JP6817655
Kind Code:
B2
Abstract:
[Problem] To provide an etching liquid which selectively dissolves a transparent conductive film without corroding copper. [Solution] An etching liquid which contains (a) hydrogen halide, (b) a metal halide, (c) a copper dissolution inhibitor which is selected from among hydroxylamine and salts thereof and (d) a diluent, while optionally containing (e) an oxidant.
Inventors:
Takeshi Kiuchi
Shimada Osamu
Shimada Osamu
Application Number:
JP2019500999A
Publication Date:
January 20, 2021
Filing Date:
February 27, 2017
Export Citation:
Assignee:
Fuji Giken Industry Co., Ltd.
International Classes:
H01L21/306
Domestic Patent References:
| JP2016178103A | ||||
| JP2010538167A | ||||
| JP2001517863A | ||||
| JP2012508965A |
Attorney, Agent or Firm:
Izawa International Patent Office
Izawa Kou
Izawa Miki
Yasuhiko Mogi
Izawa Kou
Izawa Miki
Yasuhiko Mogi