Title:
ETCHING SOLUTION AND ETCHING METHOD
Document Type and Number:
Japanese Patent JPH06349807
Kind Code:
A
Abstract:
PURPOSE: To provide an etching solution and an etching method having good controllability by a simple process and which can form submicron patterns.
CONSTITUTION: When a submicron pattern is to be etched on an InP substrate 11 having a resist pattern 12 by aqueous solution containing bromine, the bromine concentration is held below 0.5% and the temperature of the aqueous solution under 10°C and higher than the solidifying point.
Inventors:
NISHIDA TOSHIO
TAMAMURA TOSHIAKI
HIRONO TAKUO
TAMAMURA TOSHIAKI
HIRONO TAKUO
Application Number:
JP13584593A
Publication Date:
December 22, 1994
Filing Date:
June 07, 1993
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
H01L21/306; H01L21/308; (IPC1-7): H01L21/308; H01L21/306
Attorney, Agent or Firm:
Yoshikazu Tani (1 person outside)