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Title:
ETHYLENIC RESIN FOR THERMOFORMING SHEET AND THERMOFORMING SHEET
Document Type and Number:
Japanese Patent JP2010150520
Kind Code:
A
Abstract:

To provide an ethylenic resin for a thermoforming sheet excellent in balance of flexibility, thermal deformation resistance and transparency.

The ethylenic resin for the thermoforming sheet satisfies all of the following conditions: (a) a density of 890-930 kg/m3; (b) a melt flow rate (MFR) of 0.1-10 g/10 min; (c) an energy of activation for fluidity (Ea) of <50 kJ/mol; (d) Mz/Mw ≥3.5; (e) (Mz/Mw)/(Mw/Mn)≥0.9; (f) a quantitative proportion of eluted resin at ≥100°C, measured by temperature rising elution fractionation, of <1 wt.% (provided that the weight of the ethylenic resin is considered to be 100 wt.%); and (g) a melt tension at 150°C of 4-30 cN.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
EJIRI SUSUMU
NOZUE YOSHINOBU
Application Number:
JP2009262888A
Publication Date:
July 08, 2010
Filing Date:
November 18, 2009
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08F10/02; C08J5/18
Attorney, Agent or Firm:
Toru Nakayama
Toru Sakamoto