Title:
EVALUATION METHOD FOR WETTABILITY OF SOLDER
Document Type and Number:
Japanese Patent JP3314712
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an evaluation method in which the difference in the wettability of a solder paste according to the kind of a material and to the material of a test piece can be obtained clearly.
SOLUTION: A circular copper land 13 is formed on a base material 12, its circumference is covered with a solder resist 14, and a substrate 11 is constituted. The copper land 13 (solder leveler 16) on the substrate 11 is coated with a solder paste 21 in a required amount by a printing operation. A test piece 15 which is composed of a copper plate is arranged so as to be erected vertically in a longitudinally long state. This assembly is heated wholly under a prescribed temperature condition through a reflow furnace, and the solder paste 21 is melted. The wettability of the solder paste 21 is evaluated on the basis of an area wetted with the solder paste 21 with reference to the test piece 15.
Inventors:
Takayuki Nonaka
Application Number:
JP9447998A
Publication Date:
August 12, 2002
Filing Date:
April 07, 1998
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G01N13/00; H05K3/34; (IPC1-7): G01N13/00; H05K3/34
Domestic Patent References:
| JP7174686A | ||||
| JP6153548A | ||||
| JP2150550U |
Other References:
高山 金次郎，“リフローソルダリングテスタ”，電子材料，日本，工業調査会，１９９５年４月１日，第３４巻，第４号，ｐｐ．１０３−１０９
Attorney, Agent or Firm:
Tsuyoshi Sato