Title:
蒸着源、真空処理装置、及び蒸着方法
Document Type and Number:
Japanese Patent JP7179635
Kind Code:
B2
Abstract:
To provide a vapor deposition source capable of increasing furthermore a conductance of a vapor deposition material by generating excellent rectification of the vapor deposition material by a simple constitution; and to provide a vacuum treatment apparatus and a vapor deposition method.SOLUTION: A vapor deposition source includes an evaporation vessel and a dispersion plate. The evaporation vessel has a first chamber for storing a vapor deposition material, and a second chamber provided on the first chamber, and provided with a jetting nozzle for jetting out the vapor deposition material. The dispersion plate demarcates the first chamber from the second chamber in the evaporation vessel, and has a plurality of hole parts through which the first chamber communicates with the second chamber, and at least one of the plurality of hole parts is arranged inclinedly to a first direction toward the second chamber from the first chamber.SELECTED DRAWING: Figure 1
Inventors:
Masashi Umehara
Kurata Takaomi
Kurata Takaomi
Application Number:
JP2019022380A
Publication Date:
November 29, 2022
Filing Date:
February 12, 2019
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/24; H01L51/50; H05B33/10
Domestic Patent References:
| JP2011017059A | ||||
| JP2017025347A | ||||
| JP2004137583A | ||||
| JP2018003122A |
Foreign References:
| WO2012086453A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Minami Aoyama International Patent Office
Junichi Omori
Takahashi Mitsuru
Teppei Nakamura
Hibino Yukinobu
Junichi Omori
Takahashi Mitsuru
Teppei Nakamura
Hibino Yukinobu
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