PURPOSE: To reduce the working time by installing a pressing mechanism for pressing the upper surface of the edge part of a thin film, fluid spraying mechanism, and an exfoliated thin film guide member, in a thin film exfoliating device for a substrate for a printed circuitboard, thus preventing the variation of the exfoliation position and the deflection of the exfoliation stress.
CONSTITUTION: An exfoliator is equipped with a pressing mechanism for pressing the upper surface of the edge part of a thin film 1D on a substrate 1, fluid spraying mechanism 5 for spraying the fluid onto the thin film 1D at the pressed part, exfoliated thin film guide member 6B, and a thin film discharging conveyor belt mechanism. Therefore, a gap is formed in the lower part by applying a force onto the upper surface of the edge part of the thin film 1D by a pressing mechanism, and the thin film 1D can be exfoliated in a moment by spraying fluid onto the gap part. When the exfoliated thin film 1D is attached onto the exfoliated thin-film guide member 6B, a uniform exfoliation force is applied onto the thin film 1D, and exfoliation position is stabilized. Further, the exfoliation work can be automated by the thin-film discharging conveyor belt mechanism.
JPS59154447A | 1984-09-03 | |||
JPS60106744A | 1985-06-12 | |||
JP61197056B |