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Title:
排熱回収ヒートポンプ装置
Document Type and Number:
Japanese Patent JP6465218
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide an exhaust heat recovery heat pump device such that the liquid compression of the high-stage compressor of a two-stage compressor during the start-up of the device can be reliably avoided when the high-stage compressor operates using, as a suction refrigerant, a mixed refrigerant of the intermediate-pressure refrigerant from a gas-liquid separator with the intermediate-pressure refrigerant from the low-stage compressor. This exhaust heat recovery heat pump device is equipped with: an intermediate pipe L1 that introduces the refrigerant discharged from the gas-side outlet of a gas-liquid separator 4 into between the discharge port of a low-stage compression mechanism and the suction port of a high-stage compression mechanism; a bypass pipe L2 that communicates the liquid-side outlet of the gas-liquid separator 4 with a pipe which connects the refrigerant outlet Q2 of a condenser 2 and the refrigerant inlet of the gas-liquid separator 4 with a high-stage expansion valve 3 interposed therebetween; an opening and closing control valve 7 that is provided to the intermediate pipe L1; and a bypass valve 8 which is provided to the bypass pipe L2. The liquid-phase refrigerant communication port 4L of the gas-liquid separator 4 is disposed above the refrigerant outlet Q2 of the condenser 2. When the device is stopped, a control unit controls the bypass valve 8 to an open position and controls a low-stage expansion valve 5 to a closed position.

Inventors:
Atsushi Nakamura
Kensetsu Yasushima
Shuhei Shibata
Hiroyuki Terawaki
Application Number:
JP2017549927A
Publication Date:
February 06, 2019
Filing Date:
November 11, 2015
Export Citation:
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Assignee:
Fuji Electric Co., Ltd.
International Classes:
F25B1/00; F25B1/10; F25B27/02; F25B43/00
Domestic Patent References:
JP2009229051A
JP2005214444A
JP2006275435A
JP11142001A
JP1114199A
JP60261A
JP2014119157A
Attorney, Agent or Firm:
Sakai International Patent Office