To reduce reaction by-products deposited on a bellows pipe joint, to suppress the generation of particles and to prolong the maintenance period of an exhaust system.

The exhaust piping of a semiconductor manufacture device, which is provided with a heater 24 at a periphery and is heated, is provided with a bellow pipe joint 20. Both pipe end parts 26 and 27 of the bellows pipe joint 20 are lengthened and the superimposed length of the heater 24 provided at the periphery of the bellows pipe joint 20 and both end parts are lengthened. Thus, heat form the heater 24 is sufficiently transmitted to the both pipe end parts, heat is transmitted to the whole bellows pipe joint 20, the deposition of the reaction by-products is reduced and the generation of particles can be suppressed.