PURPOSE: To restrain deterioration of position recognition accuracy when recognizing an alignment mask optically through a resist by improving symmetry of a cross sectional contour of the resist applied on the alignment mark formed of a protruded streak or a groove.

CONSTITUTION: A resist film 6 is applied to a wafer 4 which is a work piece with a recessed or protruded alignment mark 5 including a surface on the alignment mark 5, and shaping is carried out by heating and softening at least an area of the resist film 6 near the alignment mark 5 up to a glass transition temperature or higher. After the resist film 6 is cooled and set, the alignment mark 5 is optically recognized through the resist film 6, and an exposure mask is aligned and exposed. In the process, a cooling device 8 can be especially provided. The heating can be performed by the use of laser beam.