Title:
EXTREMELY THIN CUTTING BLADE
Document Type and Number:
Japanese Patent JPH01183371
Kind Code:
A
Abstract:
PURPOSE:To reduce falling of a blade on relatively severe cutting condition so as to enable linear cutting by providing respective surface grinding material layer on both surfaces of a substrate into a sandwich structure. CONSTITUTION:On both surfaces of a resin made substrate 2, respective grinding material layers 1 are formed by electrodepositing or electroless plating, to provide a desired extremely thin cutting blade in a sandwich structure. In cutting hard and brittle material such as silicon semi-conductor using such a blade 10, since the blade 10 has a higher surface hardness but, in the inside, it has a preferable cutting property depending on the grinding material layer 1, it is possible to reduce falling of the blade 10 so as to perform linear cutting of the hard and brittle material.
Inventors:
MIKUNI KIWA
Application Number:
JP438288A
Publication Date:
July 21, 1989
Filing Date:
January 11, 1988
Export Citation:
Assignee:
NORITAKE DIA KK
International Classes:
B24D3/00; B24D3/06; B24D5/12; (IPC1-7): B24D3/00; B24D3/06; B24D5/12
Domestic Patent References:
| JP59143651B |
Attorney, Agent or Firm:
Masashi Kobori (1 person outside)
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