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Title:
FABRICATION METHOD OF MOLDING DIE BY ELECTRO CHEMICAL MOLDING PROCESS
Document Type and Number:
Japanese Patent JPS5527245
Kind Code:
A
Abstract:

PURPOSE: Molding die is manufactured by forging by using as a prototype the cavity embedded with undercut in such a way that molding die with high dimensional accuracy, which makes it unnecessary to effect the profiling process of the die and which enables to shorten the time of die meeting process, can be obtained.

CONSTITUTION: In the surface of a mother die 2 for electro-chemical molding formed in the reverse shape of a cavity 3, the cavity 3 is fabricated by electro- deposition of specified thicknessed Ni by means of electro-chemical molding. In an undercut part 3a of the outer surface, Ni and etc. is deposited by metal deposition method to make a padding 4 for easy removal of die and then a reinforced layer of metal deposition 5 is formed. A metal die 8 is made by using male die obtained from the female die being formed as a prototype of the cavity 3 which has copper deposition in thin style in the outer surface of a layer 5 and then the cavity 3 is mated inside a concave 9 for the discharging process to remove the mother die 2. After that, heating the die 8 outer surface of the cavity 3 is fixed by means of solder materials.


Inventors:
TAKESHITA HIROSHI
KAMIMURA YUUJI
Application Number:
JP10038678A
Publication Date:
February 27, 1980
Filing Date:
August 17, 1978
Export Citation:
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Assignee:
IKEGAMI KAKEN KOGYO
International Classes:
B29C45/00; B23H7/22; B29B13/00; B29C33/00; B29C33/38; B29C33/44; B29C41/00; B29C45/26; B29C67/00; B29D30/00; B29D30/32; C23C4/18; (IPC1-7): B23P1/00; B29C1/02; C23C7/00; C25D1/00