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Title:
フェーシング装置及びフェーシング方法
Document Type and Number:
Japanese Patent JP7283750
Kind Code:
B2
Abstract:
To provide a facing device capable of improving yield of highly accurate polish of a substrate material to be performed after polish starts until temperatures of surface plates are stable.SOLUTION: In a facing device 1 which includes facing members 22 pressed against polishing pads 11a, 12a provided for upper and lower surface plates 11, 12 of a both surface polisher 10 polishing a work-piece, a drive mechanism 3 moving the facing members 22, and a control part 4 controlling the drive mechanism 3 and facing the polishing pads 11a, 12a, there is provided a recipe setting part 5 which sets an execution recipe of first auto-facing to execute after the work-piece starts to be polished until temperatures of the surface plates are stabilized on the basis of a change of shapes of the upper and lower surface plates 11, 12. The control part 4 controls the drive mechanism 3 according to the execution recipe of the first auto-facing and performs the first auto-facing until the temperatures of the surface plates are stabilized after the work-piece starts to be polished.SELECTED DRAWING: Figure 1

Inventors:
Yuusuke Inoue
Yu Tayama
Taketoshi Kato
Application Number:
JP2019224080A
Publication Date:
May 30, 2023
Filing Date:
December 11, 2019
Export Citation:
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Assignee:
Speedfam Co., Ltd.
International Classes:
B24B37/015; B24B37/08; B24B53/017; H01L21/304
Domestic Patent References:
JP2017071017A
JP6285765A
JP2004047876A
JP2002046058A
Attorney, Agent or Firm:
Cleo International Law & Patent Office



 
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