Title:
FAN COOLING DEVICE
Document Type and Number:
Japanese Patent JP3676558
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a fan cooling device which can be mounted so as to be freely attachable and detachable regardless of the shape of a heat generator in a relatively simple structure.
SOLUTION: A device 13 constituted of a semiconductor element 22 attached to a circuit board 10, heat sink 2 having plural cooling fins 8 thermoelectrically joined with the semiconductor element 22, and the device case 4 which is mounted on the heat sink 2 so as to be freely attachable and detachable. In this case, the device case 4 is provided with a cooling fan 20, and the heat sink 2 is forcedly cooled by this cooling fan 20. The device case 4 is provided with an upper wall 26, and a pair of engaging members 58 and 60 extended from the both edge parts of an upper wall 26 downward in a substantially vertical direction. The pair of engaging parts 58 and 60 are positioned at both sides of the heat sink 2. Moreover, the pair of engaging members 58 and 60 are respectively provided with a safety lug 62 which is engaged with through- holes 16 and 17 formed on the circuit board 10 so as to be freely attachable and detachable.
Inventors:
Fumihiro Umeda
Mitsunobu Nakase
Mitsunobu Nakase
Application Number:
JP36283497A
Publication Date:
July 27, 2005
Filing Date:
December 12, 1997
Export Citation:
Assignee:
Nidec Corporation
International Classes:
H05K7/20; H01L23/467; (IPC1-7): H01L23/467; H05K7/20
Domestic Patent References:
| JP3031288U | ||||
| JP8288437A | ||||
| JP9270485A | ||||
| JP10303585A |
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