Title:
FEEDTHROUGH ELECTRODE OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2756223
Kind Code:
B2
Abstract:
PURPOSE: To prevent clearance from being formed between a through hole and an electrode, improve adhesion property between the through hole and the electrode, and then prevent the electrode from falling from the through hole in a substrate where the through hole through the substrate in the direction of front and back surfaces is formed and then a feedthrough electrode for continuing and connecting the front and rear surfaces within the through hole.
CONSTITUTION: A conductor layer 3 where a binder is added within a through hole 2 and a conductor layer 4 where no binder is included are filled and formed. The conductor layer 3 where the binder is added is provided on the peripheral surface of the through hole 2 and the conductor layer 4 which does not include the binder may be filled into the conductor layer 3. The substrate may be a sensitized glass.
Inventors:
TAGUCHI TEI
Application Number:
JP19082393A
Publication Date:
May 25, 1998
Filing Date:
July 02, 1993
Export Citation:
Assignee:
SANKYO SEIKI SEISAKUSHO KK
International Classes:
H05K1/11; H05K1/03; H05K3/40; (IPC1-7): H05K1/11
Domestic Patent References:
| JP4188689A | ||||
| JP464254A | ||||
| JP3212991A | ||||
| JP1321688A | ||||
| JP5512777A |
Attorney, Agent or Firm:
Yoshio Ishibashi
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