To provide a filament bundle pulling-out device in FW apparatus enabling the filament bundle pull out from a filament bundle supplying part by not using a driving force of a winding head, even in a case of a number of filament bundle wound being large at once, without necessary to enlarge the driving force of the winding head.

In the FW apparatus 11, filament bundles R impregnated with a resin are wound to the surface of a winding member for the filament bundle 16 revolved at a certain speed through a winding head 15 reciprocally moving in the axis direction of the winding member for the filament bundle 16. The filament bundle pulling-out device 14 is installed between a resin impregnating apparatus 13 and the winding head 15 and provided with a filament bundle pulling-out component 23 able to pull-out a filament bundle R at a defined speed from a filament bundle supplying component 12 and a tension regulating component 24 to adjust a tension of the filament bundle R stretching from the filament bundle pulling-out component 23 to the winding head 15. The filament bundle pulling-out component 23 is provided with a pair of conveyer 25 and 26 and they pull out the filament bundle R by holding the filament bundle R between a plurality of projections 29 arranged at a given interval and in parallel projected on the outer surface of a belt 28.