Title:
充填接合材、保護シート付き充填接合材、積層体、光学デバイス及び光学デバイス用保護パネル
Document Type and Number:
Japanese Patent JP6991137
Kind Code:
B2
Abstract:
The present invention aims to provide a filling-bonding material that is suitably used to fill a space between parts, while bonding the parts, in optical devices in various shapes not limited to flat shapes. The present invention also aims to provide a protective sheet-equipped filling-bonding material, a laminate, an optical device, and a protective panel for an optical device each including the filling-bonding material. Provided is a filling-bonding material having a shape with an uneven thickness.
Inventors:
Shigekazu Fukaya
Okabayashi Award Jun
Nakamura Kozo
Atsushi Wada
Hiroyuki Nakatani
Okabayashi Award Jun
Nakamura Kozo
Atsushi Wada
Hiroyuki Nakatani
Application Number:
JP2018522817A
Publication Date:
January 12, 2022
Filing Date:
January 16, 2018
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C09J7/10; B32B1/06; B32B3/06; B32B7/12; C03C27/12; C09J129/14; C09J201/00; G09F9/00
Domestic Patent References:
| JP2016513029A | ||||
| JP2009227826A | ||||
| JP60021834A | ||||
| JP8081242A | ||||
| JP2004075501A | ||||
| JP2011028239A | ||||
| JP2014508959A |
Attorney, Agent or Firm:
Patent Business Corporation Yasutomi International Patent Office