Title:
充填剤含有ポリマー分散物、その製造法およびその使用
Document Type and Number:
Japanese Patent JP5019670
Kind Code:
B2
Abstract:
A filler-containing an organic polymer dispersion is provided. The organic polymer of the dispersion is polymerized in the presence of particles of at least one filler. The ratio of the particle size of the filler particles to the particle size of the polymer particles is in the range of from 1.1:1 to 20:1.
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| WO/1993/001233 | TRANSPARENT PLASTIC MATERIAL |
| JPS52150492 | SYNTHETIC RESINS |
Inventors:
Roberto Paves Arangis
Application Number:
JP2000592337A
Publication Date:
September 05, 2012
Filing Date:
December 21, 1999
Export Citation:
Assignee:
Henkel AG & Co. KGaA
Henkel Chile S.A.
Henkel Chile S.A.
International Classes:
C08L31/00; C08F2/24; C08L101/00; C08F2/44; C08F263/04; C08F291/00; C08K3/00; C08K5/00; C09D17/00; C09D151/00; C09D201/00; C09J151/00; C09J201/00
Domestic Patent References:
| JP2274772A | ||||
| JP4114584B1 | ||||
| JP60203673A |
Attorney, Agent or Firm:
Kyousei Tamura
Samejima Mutsumi
New exemption victory
Hiroshi Sato
Samejima Mutsumi
New exemption victory
Hiroshi Sato