Title:
接触印刷を用いる厚膜ペーストでのビアの充填
Document Type and Number:
Japanese Patent JP4943148
Kind Code:
B2
Abstract:
The present invention relates to a process for filling vias in an electronic structure with thick film paste. The vias may be preexisting in a substrate comprised of thick film materials or fabricated in a photoresist layer over-coating the substrate. The invention is particularly useful in fabrication of electron field emission triode arrays where the vias are of fine dimension (<100 mum in diameter) and the electron emitter thick film paste, which may contain carbon nanotubes, is of high value.
Inventors:
Chiang, Laputac Andreux
Bike Mohammadei, Alan
Bike Mohammadei, Alan
Application Number:
JP2006518897A
Publication Date:
May 30, 2012
Filing Date:
July 08, 2004
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
H01J9/02; B05D5/12; H01J1/304; H01L21/00; H05K3/10; H05K3/40; H05K3/00; H05K3/46
Domestic Patent References:
| JPH07283512A | 1995-10-27 | |||
| JPH1093223A | 1998-04-10 | |||
| JPH07336019A | 1995-12-22 | |||
| JPH09321411A | 1997-12-12 | |||
| JPH02240996A | 1990-09-25 | |||
| JPH04351560A | 1992-12-07 | |||
| JPH0728241A | 1995-01-31 | |||
| JPH07122839A | 1995-05-12 | |||
| JP2002100282A | 2002-04-05 | |||
| JPH0999539A | 1997-04-15 |
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe