Title:
半導体用フィルム状接着剤、半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP7384171
Kind Code:
B2
Abstract:
Provided is a film-like adhesive agent 1 for a semiconductor, the adhesive agent 1 having a first thermosetting adhesive agent layer 2 and a second thermosetting adhesive agent layer 3 laid on the first thermosetting adhesive agent layer 2, the first thermosetting adhesive agent layer 2 containing a first thermoplastic resin in which Tg is lower than 35°C, and the second thermosetting adhesive agent layer 3 containing a second thermoplastic resin in which Tg is 35°C or higher.
Inventors:
Akiko Hayashide
Toshiyasu Akiyoshi
Koichi Chabana
Toshiyasu Akiyoshi
Koichi Chabana
Application Number:
JP2020558357A
Publication Date:
November 21, 2023
Filing Date:
November 15, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
H01L21/60; C09J7/30; C09J133/00; C09J163/00; C09J171/12; C09J175/04; C09J201/00
Domestic Patent References:
| JP2011018879A | ||||
| JP2012014562A1 | ||||
| JP2014210880A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Toshimasa Takabe
Yoshinori Shimizu
Hiroyuki Hirano
Toshimasa Takabe
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